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Relife RL-044 6s-16 PM
Price:
€7.67
€7.67
The Relife RL-044 6s–16PM model is a professional set of BGA stencils designed for reballing chips in Apple devices, covering models from iPhone 6s to iPhone 16 Pro Max. These stencils are designed for technicians performing repairs on motherboards and components such as CPU, NAND, Wi-Fi and Baseband modules.
Main Features
Compatibility: Suitable for models from iPhone 6s to iPhone 16 Pro Max.
Precision workmanship: Using ultra-precise round-square holes for accurate positioning of solders.
High-quality material: Made of 0.12mm thick Japanese stainless steel, ensuring resistance to high temperatures and wear.
Additional features:
Patented design with cooling holes for rapid heat dissipation.
Half-etching for better fit to components and prevention of overheating.
Double blister packaging for protection during transportation.
📦 The set includes
Templates for reballing CPU, NAND, Wi-Fi and Baseband modules.
Templates for protecting flex cables when dismantling IC components.
A total of 4 templates, covering models from iPhone 6s to iPhone 16 Pro Max.
Compatibility: Suitable for models from iPhone 6s to iPhone 16 Pro Max.
Precision workmanship: Using ultra-precise round-square holes for accurate positioning of solders.
High-quality material: Made of 0.12mm thick Japanese stainless steel, ensuring resistance to high temperatures and wear.
Additional features:
Patented design with cooling holes for rapid heat dissipation.
Half-etching for better fit to components and prevention of overheating.
Double blister packaging for protection during transportation.
📦 The set includes
Templates for reballing CPU, NAND, Wi-Fi and Baseband modules.
Templates for protecting flex cables when dismantling IC components.
A total of 4 templates, covering models from iPhone 6s to iPhone 16 Pro Max.
Quantity
1+
Price
